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ITData recovery from an iPhone SE2 motherboard is a meticulous process, especially when crucial components like the CPU and NAND chip are involved. This guide walks you through the detailed steps required to successfully recover data by swapping key encrypted chips to a new board. Whether you’re a seasoned technician or a DIY enthusiast, following these steps will help ensure a successful recovery.
Détails du téléphone :
Modèle : iPhone SE2 (2020)
Annoncé : 2020, April 15
Phénomène de défaut
When a client sends in just the motherboard of an iPhone SE2, it often means they’re desperate to recover valuable data. In this case, the challenge is even greater because the CPU, crucial for data recovery, has already been removed by another technician. Our task? To carefully swap the encrypted chips to a new board to retrieve the data.
Detailed Process
1. Assessing the CPU and NAND Chip
The CPU is the key to unlocking the data on the iPhone, so it’s essential to check its condition first. Under the microscope, the CPU appears cosmetically intact, which is a good sign. The NAND chip, another vital component, also looks untouched and has not been resoldered.
2. Removing and Reballing the NAND Chip
- To begin, remove the NAND chip using a hot air gun and a blade knife. Once removed, reball the pads on the NAND to prepare it for the new board.
- Next, examine the donor board where the CPU, Baseband CPU, and NAND chip have been removed. Connect the board to a DC power supply and trigger it with pincettes. A stable boot current of around 12mA indicates that everything is normal and ready for the next step.
3. Soldering the NAND and CPU Chips
- Start by soldering the NAND chip using a QUICK 9008 tool, setting the temperature to approximately 340℃. After successfully soldering the NAND, proceed to the CPU.
- This step requires extreme precision. Align the CPU carefully and control both the heating distance and time. When the flux under the CPU chip starts to flow, gently push the CPU. If it returns to its original position, stop heating.
- With both the NAND and CPU chips soldered, it’s time to test the motherboard. Connect it to a screen and trigger the boot process. The appearance of the Apple logo followed by a reboot loop is expected at this stage, as the logic EEPROM is not yet soldered.
4. Swapping the Logic EEPROM
The next step involves swapping the logic EEPROM. Although the swap process is simple, the chip is tiny, requiring careful control of heating temperature, time, and distance to avoid damaging or displacing the chip.
Alternative Option: Use a Logic EEPROM Reader to read and write the encrypted data without the need for soldering.
5. Testing and Soldering the Baseband CPU
- After soldering the NAND, CPU, and logic EEPROM, boot the iPhone again. If it prompts an update failure, this is likely due to the Baseband CPU not being installed yet. The Baseband CPU is encrypted and must be handled with care. The soldering process is similar to that of a standard BGA chip.
- After the Baseband CPU is successfully soldered, enter the unlock PIN to place the phone in recovery status. If the phone repeatedly enters recovery mode, the NFC chip may also need to be swapped.
6. Final Assembly and Testing
In the final step, assemble the phone and perform a complete test. If the phone boots normally and shows “No SIM card,” this indicates the Baseband function is operational. Enter the unlock code to access the system. If successful, the data is intact and can be backed up using iTunes.
Résumé
Recovering data from an iPhone SE2 requires the careful swapping of four key chips:
- NAND
- UNITÉ CENTRALE
- Unité centrale de bande de base
- Logique EEPROM
Additionally, the NFC chip may need to be swapped to avoid persistent recovery mode issues. By following these detailed steps, you can successfully retrieve the data and bring the iPhone back to life.
